发明名称 |
Electroplating of copper from alkanesulfonate electrolytes |
摘要 |
Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or submicron dimensioned trenches or vias. |
申请公布号 |
EP1092790(A3) |
申请公布日期 |
2002.09.11 |
申请号 |
EP20000309095 |
申请日期 |
2000.10.16 |
申请人 |
ATOFINA CHEMICALS, INC. |
发明人 |
MARTYAK, NICHOLAS M.;GERNON, MICHAEL D.;JANNEY, PATRICK |
分类号 |
C25D3/38;C25D5/56;C25D7/00;C25D7/12;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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