发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus which is useful for forming an optical thin film or the like, easy to control film formation with a simple structure, can form a film of high quality at high speed, inexpensively and stably, and has a forming function for generating an oxide film, nitride, or the like, from a metal thin film. SOLUTION: The sputtering apparatus is provided with a turntable (2) for mounting a substrate group (3) on the surface of which a metal-compound thin-film is formed; a metal thin-film forming part (4) for forming the sputtered metal thin-film, and a metal-compound film forming part (5) for forming the metal-compound film through a reaction of active gas irradiated with plasma right after the formation of the metal thin-film, in a vacuum chamber (1). The metal thin-film forming part (4) and the metal-compound film forming part (5) are arranged separately so as to face each other in a rotating direction on the top surface of the turntable (2).
申请公布号 JP2002256428(A) 申请公布日期 2002.09.11
申请号 JP20010055928 申请日期 2001.02.28
申请人 SHIBAURA MECHATRONICS CORP 发明人 KINOKIRI KYOJI;ITO AKIHIKO
分类号 G02B1/10;C23C14/34 主分类号 G02B1/10
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