ADHESIVE SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of suppressing a reflow crack, and having wafer fixing functions and die-bonding functions at the same time. SOLUTION: This adhesive sheet has an adhesive layer usable as a die- bonding agent on a radiation-polymerizable substrate. Thereby, the adhesive sheet having both the wafer fixing functions and the die-bonding functions at the same time can be provided. Since the water absorption coefficient of the adhesive layer is regulated to a low level and the modulus of elasticity is reduced or residual volatile components are reduced, the reflow crack can be prevented from occurring in a high-temperature reflow step.