发明名称 MAGNETRON SPUTTERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a magnetron sputtering device which can form a film of little damage and high density, and has high utilizing efficiency for a target. SOLUTION: The magnetron sputtering device having the target to be sputtered and a magnetic-field generating means arranged at a rear side in order to generate a magnetic field on a surface of the target, comprises arranging several first magnetic-field generating means at the back side of the target, and arranging second magnetic-field generating means having an opposite magnetic pole against the first generating means through a yoke, in vicinity of or behind the first generating means which is located at the brim side of the target, to form the unbalanced magnetic fields on the surface side of the target.
申请公布号 JP2002256431(A) 申请公布日期 2002.09.11
申请号 JP20010058371 申请日期 2001.03.02
申请人 SANYO SHINKU KOGYO KK 发明人 KITAHATA AKIHIRO;SUGIMOTO KUNIHIKO
分类号 C23C14/35;H01L21/203;(IPC1-7):C23C14/35;//H01L21/2 主分类号 C23C14/35
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