发明名称 |
A method of forming a switch pattern on a switch substrate and a switch substrate |
摘要 |
<p>A method of forming switch patterns on a substrate (10) comprising the steps of forming patterns (11,111) on the surface of the substrate (10) and then removing pattern-removal portions of said patterns (11,111) is disclosed. Removal of the pattern removal portions may be mechanical or by means of a laser beam. An alternate method of forming switch patterns in which patterns (11-3) are formed on a surface, insulating patterns (27-3) formed at portions between said patterns (13-3,17-3) that are to become switch patterns and then forming switch patterns (11-3) by removing pattern removal portions at boundaries between said patterns and said insulating patterns (27-3) is also disclosed, along with substrates (10,10-3) according to either method. <IMAGE></p> |
申请公布号 |
EP1190830(A3) |
申请公布日期 |
2002.09.11 |
申请号 |
EP20010126175 |
申请日期 |
1999.12.22 |
申请人 |
TEIKOKU TSUSHIN KOGYO CO. LTD. |
发明人 |
NOMURA, OSAMU;YAGI, NOBUYUKI;MORITA, KOZO |
分类号 |
B29C45/14;H01H1/40;H01H11/00;H01H19/00;H05K3/00;H05K3/20;H05K3/22;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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