| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition for connecting circuits capable of connecting the circuits having high reliability on stabilized connection resistance, forming a fine structure of the circuits and readily carrying out restoration of connecting parts, and to provide a heat seal connector. SOLUTION: This composition for connecting the circuits consists essentially of the following components (1) to (4) and has 0.1-15 vol.% content of pressure- deformable electroconductive particles based on the components (1), (2) and (4). (1) an epoxy reactive adhesive, (2) covered particles in which the surface of a curing agent for the reactive adhesive as a core is substantially covered with a film, (c) the pressure-deformable electroconductive particles obtained by covering the surface of the polymeric core material having a smaller average particle diameter than that of the covered particles with a metal thin layer and (4) a thermoplastic resin.
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