TAPE MOUNTING APPARATUS

摘要

PURPOSE: A tape mounting apparatus is provided to eliminate the necessity for transferring a wafer to a receiving receptacle of which the side surface is open, by absorbing the upper surface of the wafer received in the receiving receptacle like a jar pack of which the upper surface is open. CONSTITUTION: A plurality of thin wafers(101) are supplied to a load unit, having an upper surface on which an integrated circuit is formed. An align unit is positioned in the center of the lower surface of the respective wafers. The align unit aligns the wafer over a wafer holder in which a vacuum absorbing unit(153) is formed. A mount unit makes tape attached to the lower surface of the aligned wafer. An unload unit unloads the wafer to which the tape is attached. The first wafer transferring unit(150a) transfers the wafer from the load unit to the align unit. The second wafer transferring unit transfers the wafer from the align unit to the mount unit. The third wafer transferring unit transfers the wafer from the mount unit to the unload unit. The load unit includes the jar pack(105) which is the receiving receptacle of which the upper surface is open. The wafers are stacked in the jar pack by interposing an interleaf(102). The first wafer transferring unit includes a wafer finger(151) and the first detector(152a), wherein the wafer finger having the vacuum absorbing unit for absorbing the upper surface of the wafer and the first detector differentiates the wafer from the interleaf.