发明名称 Epoxy resin composition and optical information recording medium using the same
摘要 An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol type epoxy resin (A) as an active ingredient, epoxy resin (B) shown in the following formula and cationic polymerization catalyst (C).The epoxy resin composition can improve the thermal resistance of the adhesive layer in an optical information recording medium, and the adhesive property of the adhesive layer is not lowered even if its hardness is increased or it is in high humidity.where R isn=1 to 4
申请公布号 US6447867(B1) 申请公布日期 2002.09.10
申请号 US20000591695 申请日期 2000.06.09
申请人 SONY CHEMICALS CORPORATION 发明人 KOMINAMI HIRAKU;HAYASHI KOZABURO;SHIBATA KAZUKI
分类号 C08L63/00;C08F2/48;C08G59/00;C08G59/18;C08G59/20;C08G59/32;C08G59/38;C08G59/68;G11B7/24;G11B7/257;(IPC1-7):B32B3/02 主分类号 C08L63/00
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