发明名称 Electrical interconnecting device for a semiconductor assembly
摘要 A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.
申请公布号 US6449165(B1) 申请公布日期 2002.09.10
申请号 US20000543595 申请日期 2000.04.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE SANG-DON;KIM YOUNG-JAI
分类号 G01R1/04;H05K7/10;(IPC1-7):H05K7/10 主分类号 G01R1/04
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