发明名称 |
Electrical interconnecting device for a semiconductor assembly |
摘要 |
A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.
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申请公布号 |
US6449165(B1) |
申请公布日期 |
2002.09.10 |
申请号 |
US20000543595 |
申请日期 |
2000.04.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SANG-DON;KIM YOUNG-JAI |
分类号 |
G01R1/04;H05K7/10;(IPC1-7):H05K7/10 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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