发明名称 |
Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
摘要 |
An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.
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申请公布号 |
US6449520(B1) |
申请公布日期 |
2002.09.10 |
申请号 |
US20010945794 |
申请日期 |
2001.09.05 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LIN ZHIHONG J.;WANG CHONGYANG |
分类号 |
B65G49/07;G06Q10/00;H01L21/00;H01L21/677;(IPC1-7):G06F19/00 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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