发明名称 |
Three commonly housed diverse semiconductor dice |
摘要 |
An SO-8 type package contains a control MOSFET die mounted on one lead frame section and a synchronous MOSFET and Schottky diode die is mounted on a second lead frame pad section. The die are interconnected through the lead frame pads and wire bonds to define a buck converter circuit and the die and lead frame pads are overmolded with a common insulation housing. |
申请公布号 |
US6448643(B2) |
申请公布日期 |
2002.09.10 |
申请号 |
US20010812464 |
申请日期 |
2001.03.20 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
CHEAH CHUAN;THAPAR NARESH;THIRUVENKATACHARI SRINI |
分类号 |
H01L23/495;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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