发明名称 SAW WIRE FOR WIRE SAW AND MACHINING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a saw wire for a wire saw that facilitates wire extraction from a workpiece even in machining with a wire saw using bonded abrasive grains, and a machining method using the saw wire. SOLUTION: The wire saw is of a type having abrasive grains fixed to the wire 1 and machining a workpiece with the bonded abrasive grains, and the wire 1 has grainless portions 1-2 with no abrasive grains 2 fixed in a part or a plurality of parts. After the wire saw is used to cut the workpiece, when the wire 1 is extracted from the workpiece, the grainless portion 1-2 of the wire 1 is moved into contact with the workpiece, and the wire 1 in the region of the grainless portion 1-2 thereof is extracted from the workpiece.
申请公布号 JP2002254327(A) 申请公布日期 2002.09.10
申请号 JP20010057706 申请日期 2001.03.02
申请人 NGK INSULATORS LTD 发明人 ONO KATSUHIRO;ITO YUJI
分类号 B24B27/06;B24D11/06;B28D5/04;(IPC1-7):B24D11/06 主分类号 B24B27/06
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