发明名称 ABRASIVE TAPE
摘要 PROBLEM TO BE SOLVED: To provide an abrasive tape that is suitable for final finishing of a precision part surface and the like of an optical connector ferrule, a semiconductor wafer and the like, and a manufacturing method thereof. SOLUTION: The abrasive tape 10 has an abrasive layer 13 formed on an abrasive tape backing 11, if necessary, via a primer layer 12 by the application of a coating mixture where abrasive grains of a mean grain size of 1 to 200 mμare dispersed in a bond resin liquid.
申请公布号 JP2002254326(A) 申请公布日期 2002.09.10
申请号 JP20020061525 申请日期 2002.03.07
申请人 DAINIPPON PRINTING CO LTD 发明人 FUJII KAZUHITO;OKAWA KOJIRO;YAMAGUCHI MASAHISA;MIYAJI TAKAKI;SUZUURA YASUKI
分类号 B24D11/00;B24D3/00;(IPC1-7):B24D11/00 主分类号 B24D11/00
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