| 摘要 |
A method of making a PCB having an integral heat spreader and/or central ground plane includes forming one or more first openings in a first layer of a metal at selected locations and filling the. openings with an electrically insulating material. The first sheet is laminated between second and third layers of a metal interleaved with first and second layers of a dielectric material. At least one second opening is formed through the insulating material in one of the first openings, and at least one third opening is formed in the laminate at a position displaced from the first openings. The upper and lower layers of metal are electrically connected to each other through the at least one second and third openings to define "vias" through the laminate. The vias comprise "clearance vias" from which the first metal sheet is electrically isolated, and "thermal vias" to which the first metal sheet is electrically connected. The thermally enhanced PCB is fabricated using only conventional PCB fabrication techniques.
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