| 摘要 |
A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately. |
