| 摘要 |
An electronic component mounting apparatus and an electronic component mounting method are provided which improve the productivity by reducing the cycle time. The electronic component mounting method includes the steps of a) picking up an electronic component from a first supplying section or a second supplying section respectively disposed on each side of a substrate, b) recognizing the electronic component by a recognition section, and c) moving and mounting the electronic component on the substrate. Frequently used electronic components are stored in both of the first and second supplying sections. The electronic components are picked up from the first supplying section and mounted on the substrate in the normal operating conditions. When the electronic components stored in the first supplying section run out, the same kind of components are provided by the second supplying section to continue the mounting operation. In the mean time, the first supplying section is replenished with the electronic components, and when replenishment is completed, the electronic components are again, provided by the first supplying section, to continue the mounting operation. Thereby, carriage distance in the normal operating conditions becomes shorter which reduces the cycle time.
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