发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device which permits a workpiece to be polished until a desired thickness is obtained surely, by detecting the change of the relative distance between upper/lower wheels with high accuracy. SOLUTION: The polishing device is provided with a displacement detecting means 17 of a non-contact type which detects a relative displacement between an upper wheel 1 for pressing the workpiece w and lower wheel 2 for supporting the workpiece w. In the displacement detecting means 17, a probe 18 having an exciting coil 23 and a detecting coil 24 is inserted into the shaft center of a hollow hole 2a which is formed in the axial direction of the lower wheel 2, and a differential transformer having a ring shape yoke 19 fixed at a position approximately opposite to each coil 23 and 24 of the probe 18, is provided on the inside surface of the hollow hole 2a; further the top of the probe 18 is connected to the upper wheel 1 to permit vertical motion integrally moving together with the upper wheel.
申请公布号 JP2002254300(A) 申请公布日期 2002.09.10
申请号 JP20010046489 申请日期 2001.02.22
申请人 MURATA MFG CO LTD 发明人 NISHIKAWA TORU;INAO TAKESHI
分类号 B24B49/04;B24B37/013;B24B37/07;B24B49/10;H01L21/304 主分类号 B24B49/04
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