| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and a polishing apparatus for an electronic part which can uniformly polish and chamfer corners and edges of the electronic part. SOLUTION: The manufacturing method and the polishing apparatus are configured such that the corners and edges of the electronic part 31 are polished and chamfered in such a manner that a plurality of electronic parts are put in a container 13 together with an abrasive 16, stone ball 15 and liquid medium 17, which has a polygonal shape comprising a plurality of faces 4 joined each other to form the inner peripheral face 3 of a side wall 2, and a bottom 6 and a top lid 5 that block top and bottom faces of the polygon, which have ridged grooves 11, 12 formed at each inner face, then the container 13 is rotated. |
