发明名称 Apparatus and nozzle device for gaseous polishing
摘要 A gaseous polishing apparatus and a nozzle device designed for gaseous polishing perform precision polishing on a surface of an object to be polished. The nozzle device includes a nozzle body having a nozzle opening provided at a downstream end thereof for ejecting polishing gas. A shutter device is disposed in proximity to the nozzle opening so as to control ejecting and stopping of the polishing gas towards the object surface. A control mechanism controls opening and closing action of the shutter device.
申请公布号 US6447632(B1) 申请公布日期 2002.09.10
申请号 US19990272170 申请日期 1999.03.18
申请人 EBARA CORPORATION 发明人 SHINOZUKA SHYUHEI;MIYOSHI KAORI;FUKUNAGA AKIRA
分类号 C23F3/00;H01L21/00;(IPC1-7):C23F1/02 主分类号 C23F3/00
代理机构 代理人
主权项
地址