发明名称 |
Apparatus and nozzle device for gaseous polishing |
摘要 |
A gaseous polishing apparatus and a nozzle device designed for gaseous polishing perform precision polishing on a surface of an object to be polished. The nozzle device includes a nozzle body having a nozzle opening provided at a downstream end thereof for ejecting polishing gas. A shutter device is disposed in proximity to the nozzle opening so as to control ejecting and stopping of the polishing gas towards the object surface. A control mechanism controls opening and closing action of the shutter device.
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申请公布号 |
US6447632(B1) |
申请公布日期 |
2002.09.10 |
申请号 |
US19990272170 |
申请日期 |
1999.03.18 |
申请人 |
EBARA CORPORATION |
发明人 |
SHINOZUKA SHYUHEI;MIYOSHI KAORI;FUKUNAGA AKIRA |
分类号 |
C23F3/00;H01L21/00;(IPC1-7):C23F1/02 |
主分类号 |
C23F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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