| 摘要 |
1278647 Semi-conductor devices MOTOROLA Inc 12 Aug 1969 [21 Aug 1968] 40266/69 Heading H1K An electrical component such as the thyristor 18 illustrated is supported by an annular shelf 20 extending inwardly from an insulating carrier ring 21, e.g. of plastics material, and is contacted on opposite sides by respective central portions 12, 13 of a pair of pressure contact members 10, 11. Outwardly directed flexible annular portions 14, 15 of the contact members 10, 11 engage the outer periphery of the carrier ring 21 and are secured and sealed thereto by an insulating locking ring 35 which, in the embodiment shown, comprises a plastics ring moulded around the edge of the device housing by means of an annular die set 60, but which may alternatively comprise a two-part ceramic ring. A conductor 23 extends through the locking ring 35 and carrier ring 21 to the vicinity of the device 18 where, in the arrangement shown, it is connected to a conducting ring 22 and then, through a wire 26, to the gate electrode 25 of the thyristor. Silicone material 49 covers the edge of the device 18. A plurality of gate electrodes may be provided, each connected by wire or by part of a lead frame to the conducting ring 22 in the vicinity of a recess 30 within the carrier ring 21. External contact to the main electrodes of the device 18 is made by radial terminals such as 46 extending into the locking ring 35 and brazed to tabs 40 on the contact members 10, 11. Other tabs 38, 39 on the members 10, 11 serve to lock the inner parts of the housing within the moulded locking ring 35. A three-layer diode or triac for use in triggering the main thyristor may be supported on the gate electrode 25, and other electrical elements may also be inserted in the space between the contact members 10, 11 and the carrier ring 21. Transistors may be encapsulated in the housing to which the invention relates. |
