发明名称 APPARATUS FOR BONDING PLATE-SHAPED OBJECTS TOGETHER AND METHOD FOR BONDING PLATE-SHAPED OBJECTS TOGETHER
摘要 <p>An apparatus for bonding plate-shaped objects together comprising vacuum-clamping means (10, 20) serving also as electrodes for vacuum-clamping first and second optical disc substrates, optical disc substrate moving means (40) for allowing the second optical disc substrate to approach the first optical disc substrate, distance measuring means (50) for measuring the distance between the optical disc substrates, speed control means (60) for controlling the relative speed of the second optical disc substrate with respect to the first one and controlling the optical disc substrates moving means so that the relative speed of the second optical disc substrate with respect to the first one after the time immediately before the adhesive (30) on the second optical disc substrate comes into contact with the first one is lower than that before the time immediately before the adhesive (30) on the second optical disc substrate comes into contact with the first one, and alternating voltage applying means (7) for applying an alternating voltage between the optical disc substrates immediately before the adhesive applied to the second optical disc substrate comes into contact with the first optical disc substrate.</p>
申请公布号 WO02068554(A1) 申请公布日期 2002.09.06
申请号 WO2002JP01080 申请日期 2002.02.08
申请人 ORIGIN ELECTRIC COMPANY, LIMITED;SHINOHARA, SHINICHI;KOBAYASHI, HIDEO;NAKAMURA, MASAHIRO;KAJI, KANYA 发明人 SHINOHARA, SHINICHI;KOBAYASHI, HIDEO;NAKAMURA, MASAHIRO;KAJI, KANYA
分类号 C09J5/02;B29C65/52;C09J5/04;G11B7/26;(IPC1-7):C09J5/00 主分类号 C09J5/02
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