| 摘要 |
<p>A method and apparatus (5) for processing a panel stack having one or more panels are provided. The panel stack (10) is provided with at least one through-hole (15). Fluid or gas may be passed through the through-hole (15) via a fluid communication path (18) between the through-holes. By inhibiting the contact of the fluid or gas from the flat surfaces of the panels, processing of the through-holes can be accomplished with reduced resources more quickly. Panel stacks can include one to at least hundreds of panels. Various applications include electroless copper deposition, electroplating of copper for a printed circuit board, chemical etchback or desmear, honing of the through-hole wall using a slurry of pumice as a replacement for chemical etchback or desmear, chemical microetching of a through-hole wall and through-hole blasting with pressurized water or air to clean away any debris.</p> |
