发明名称 COMPONENT MOUNTING DEVICE AND MOUNTING FACILITY
摘要 PROBLEM TO BE SOLVED: To obtain a component mounting device in which a mounting operation is quickened and the replacement of a component is facilitated. SOLUTION: The component mounting device comprises a section 24 for positioning a board 37, a pair of component feed tables 28A mounting a plurality of component feeding means 12 and being moved to specified positions on both sides of the board positioning section 24 and fixed thereat, a first mounting head section 31 for sucking a component 34 on one component feed table 28A sequentially by means of a plurality of component suction nozzles 33 and then mounting the sucked component 34 sequentially on the substrate 37, and a second mounting head section 31 for sucking the component 34 on the other component feed table 28A sequentially by means of a plurality of component suction nozzles 33 and then mounting the sucked component 34 sequentially on the substrate 37.
申请公布号 JP2002252494(A) 申请公布日期 2002.09.06
申请号 JP20020047924 申请日期 2002.02.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HATA KANJI;YOSHIDA NORIAKI
分类号 H05K13/04 主分类号 H05K13/04
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