MULTILAYER WIRING STRUCTURE, ITS MANUFACTURING METHOD, ELECTRONIC CIRCUIT DEVICE, AND ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring structure using an interlayer connecting method by which the manufacturing process of a multilayer wiring board can be shortened, the amount of a chemical use that is considered to be high in effect or the environment can be reduced, and sufficient connecting strength is obtained, and to provide a method of manufacturing the structure, an electronic circuit device, and an electronic part. SOLUTION: The multilayer wiring structure is constituted by alternately laminating two pieces 2 and 4 of metal foil and an insulating layer 3 and electrically connecting the two pieces 2 and 4 of metal foil to each other through a non-through via hole 7. The hole 7 contains scattered metallic particles 9 in its internal wall section. The two pieces 2 and 4 of metal foil and scattered metallic particles 9 are of the same metal, and made of copper.