| 摘要 |
PROBLEM TO BE SOLVED: To provide copper alloy foil for lamination which has small surface roughness, and can directly be adhered with a polyimide without a roughening plating treatment in a printed circuit board using the polyimide as a resin board. SOLUTION: The copper alloy foil for a lamination has a componential composition of addition elements of, by mass, 1.0 to 4.8% Ni and 0.2 to 1.4% Si, and the balance copper with inevitable impurities. The alloy foil has tensile strength of >=650 N/mm<2> , electric conductivity of >=40% IACS, and surface roughness of <=2μm by the ten point average surface roughness (Rz). Thus, its 180 deg. peel strength when directly joined with a polyimide film without undergoing roughening plating treatment is >=8.0 N/cm. |
