发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating device arranged a number of cylindrical vessels in a plating bath with a simple constitution. SOLUTION: The plurality of cylindrical vessels 8 are attachably and detachably attached around a rotating shaft of a rotating member 7 which is rotatively driven in the plating bath, at the same time, a conductive wire 16 of cathode side is connected with a conductive part which is disposed on the rotating member 7, the conductive part is connected with cathodes 26 in the respective cylindrical vessels 8 via attachable and detachable attaching parts of the respective cylindrical vessels 8 and, thereby, a number of cylindrical vessels 8 are arranged with a simple constitution.
申请公布号 JP2002249898(A) 申请公布日期 2002.09.06
申请号 JP20010050111 申请日期 2001.02.26
申请人 HASE GIKEN KK 发明人 HASE SAKUJI
分类号 C25D17/00;C25D17/22;C25D21/00;(IPC1-7):C25D17/00 主分类号 C25D17/00
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