| 摘要 |
PROBLEM TO BE SOLVED: To easily and simultaneously form an accurate circuit electrode pattern, in which a line edge is regulated as compared with a conventional system, and a terminal electrode having a certain amount of thickness. SOLUTION: An electronic component packaging board has specific circuit electrode patterns 13A to 13C, flip-chip system semiconductor chips 11A and 11B that are packaged to the circuit electrode patterns 13A to 13C, terminal electrodes 15A and 15B that are connected to the semiconductor chip 11A and 11B, and a sealing member 12 that is insulated and sealed so that the entire portions of the circuit electrode patterns 13A to 13C and semiconductor chips 11A and 11B, and one portion of the terminal electrodes 15A and 15B are covered. In the circuit electrode patterns 13A to 13C, a desired conductive member is formed by plating on one surface of a conductive base that can be plated and etched. In the terminal electrodes 15A and 15B, the conductive base is selected, etched, and removed for simultaneous forming after the desired conductive member is formed by plating on both the surfaces of the conductive base, so that the manufacturing of the thin semiconductor chip packaging board is conducted since no organic substrates such as a prepreg are used. |
