| 摘要 |
PROBLEM TO BE SOLVED: To improve light reflectivity at an interface of a semiconductor layer and a contact electrode, and restrain electrode peeling by simultaneously improving adherence of an electrode, in a semiconductor light-receiving device. SOLUTION: In a semiconductor structure constituting the semiconductor light-receiving device, a dielectric film is formed in a region where incident light is reflected, and the contact electrode is formed around the dielectric film. A close contact electrode is arranged on the contact electrode, brought into contact with the dielectric film and the contact electrode. |
