发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device in which an electronic component can be mounted automatically without requiring any manual regeneration processing of CAD data. SOLUTION: At the time of generating the CAD data 2 by means of a printed board design CAD 1, the CAD data 2 is generated by adding height data of the electronic components being mounted on the printed board. The CAD data 2 thus obtained and article number data 5 are taken into the mounting-device body 3 where automatic insertion data and automatic mounting data, including the mounting order of the electronic components, are regenerated from CAD data 8 including the height data of the electronic components and the article number data. The electronic components are mounted on the printed board based on the automatic insertion data and automatic mounting data thus obtained. Since it is not required to manually generate mounting order data for mounting the electronic components sequentially from a high-profile component to a low-profile component and to add that data to the CAD data, labor required for regenerating the automatic insertion data and automatic mounting data can be reduced greatly.
申请公布号 JP2002252500(A) 申请公布日期 2002.09.06
申请号 JP20010050837 申请日期 2001.02.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KOBAYASHI MASAAKI
分类号 G06F17/50;H05K3/00;H05K13/04 主分类号 G06F17/50
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