发明名称 METHOD OF FORMING METAL ELECTRODE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a formation method for a metal electrode pattern by which the exfoliation and removal of the metal film can be efficiently performed by an adhesive sheet, in a method of forming a metal electrode pattern at the electrode part on a substrate, by sticking an adhesive sheet for exfoliation and removal of a metal film on the metal film provided on the surface of the insulating part and the electrode part made on a substrate, and then peeling off the adhesive sheet concerned thereby exfoliating and removing the metal film on the surface of the insulation part. SOLUTION: In the method of forming the metal electrode pattern at the electrode part on the substrate, the adhesive sheet is peeled off along a plate- shaped object, when peeling off the adhesive sheet.
申请公布号 JP2002252183(A) 申请公布日期 2002.09.06
申请号 JP20010045962 申请日期 2001.02.22
申请人 NITTO DENKO CORP;DENSO CORP 发明人 TOYODA HIDESHI;INO KOJI;KONDO ICHIJI
分类号 H01L21/28;H01L21/3205;(IPC1-7):H01L21/28;H01L21/320 主分类号 H01L21/28
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