| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for peeling an integrated circuit (IC) chip. SOLUTION: The method for peeling the IC chip includes a step of supplying and fixing a substrate carrying the IC chip on its surface, and softening or melting an anisotropic conductive film (ACF) existing between the chip and the substrate by heating the projected portion of a position from which the chip is removed on the rear surface of the substrate from the rear side of the substrate; and removing the chip from the substrate in the nonvertical direction. The device for peeling the IC chip incorporates a fixing base on which the substrate is fixed, a heating unit which heats the projected portion on the rear surface of the substrate, and a removing unit which removes the chip from the substrate after heating.
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