| 摘要 |
<p>A plating device and a plating method are provided that are capable of uniformly plating the treatment surface of a treatment subject. A plating device comprising a plating solution tank capable of receiving a plating solution and having a first electrode to be immersed in the received plating solution, a treatment subject holding mechanism for holding the treatment subject and contacting its treatment surface with the plating solution, and a contact disposed in the treatment subject holding mechanism for making electric contact with the peripheral edge of the treatment subject so as to use the electrically conductive layer on the treatment subject surface contacted with the plating solution as a second electrode, the contact having a bellows construction or a spring construction movable in a direction opposed to the treatment subject, the treatment subject holding mechanism being capable of holding the treatment subject in a state in which the bellows construction or the like of the contact is compressed. The contact itself is changed from rigid structure to pliable structure, ensuring that the contact resistance is made constant by contact pressure variations so controlled that even if more or less displacement in the compression direction takes place, the variations in the contact pressure are very small.</p> |
