IC COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an IC component mounting device in which a tool can be controlled so as to have a desired temperature and an appropriate bonding state can be attained stably at all times. SOLUTION: A mounting head has a tool fixing part 61 provided with a heater 68 and a means 69 for detecting a temperature in the tool fixing part. On the other hand, a means 80 for detecting a temperature in the IC component suction face 41a of the tool 41 is provided and the relative relation of temperatures detected by both temperature detecting means is determined. The heater 68 is controlled based on a temperature detected by the means 69 for detecting the temperature in the tool fixing part.