| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hot plate unit in which a side face or a periphery of the bottom face of a ceramic substrate does not contact with a support housing so that a heated object such as a silicon wafer can be heated uniformly. SOLUTION: In this hot plate unit, a resistance heater is formed on or in the ceramic substrate that is arranged in the support housing. The ceramic substrate is supported by support members arranged in the support housing, and the support housing does not contact with the ceramic substrate.</p> |
