| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive method for forming a wiring protective film, where when an organic or inorganic viscous material is applied on the surface of a substrate, the organic or inorganic viscous material can be applied efficiently and continuously, and a thick coating film in a stable shape with reduced bleeding and bubbles can be obtained by a simple process and non- contact application. SOLUTION: The method forms the protective film between pointed electrode terminals formed on the substrate by discharging the viscous material from a nozzle, where the pressure of a gas forces the viscous material to be discharged from the nozzle, and while a discharge speed of the vicious material from the nozzle is adjusted by changing the pressure of the gas applied to the viscous material, the viscous material is discharged between the pointed electrode terminals in non-contact manner so that the area between the pointed electrode terminals on the substrate other than the wiring connection area of the tips of the pointed electrode terminals is applied.
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