| 摘要 |
<p>This invention relates to an electrostatic chuck 10 which comprises a top ceramic layer 11, an intermediate ceramic layer 12 and a pattern 13, the top layer 11 and intermediate layer 12 being bonded by a layer of adhesive 14 in which an electrode 15 is also located. The electrode is significantly smaller than the wafer location, with the result that the portion 11 is effectively oversized protecting the electrode from etching around the edge of the wafer. The arrangement also reduces backside etching of the wafer, good edge cooling of the wafer and improved uniformity and processing.</p> |
