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发明名称
PLASTIC SEMICONDUCTOR PACKAGE
摘要
<p>Un cadre de montage (330) comprend un plot de connexion de puces (334) ainsi que des conducteurs (332). Une partie de la surface supérieure du plot possède une partie évidée (371) ou un sillon (474).</p>
申请公布号
WO2002069400(A1)
申请公布日期
2002.09.06
申请号
US2002005695
申请日期
2002.02.25
申请人
发明人
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主分类号
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