发明名称 III GROUP NITRIDE SEMICONDUCTOR ELEMENT AND III GROUP NITRIDE SEMICONDUCTOR SUBSTRATE
摘要 A LD structure is formed by growing stepwise, on a GaN substrate (501), a n-type cladding layer (502), a n-type optical confinement layer (503), a three-periodic multiple quantum well (MQW) layer (504), a cap layer (505), p -type optical confinement layer (506) comprising Mg-doped p-type GaN, a p-type AlGaN cladding layer (507) and a p-type contact layer (508) comprising Mg-doped p-type GaN. The p-type AlGaN cladding layer (507) has a multiple layer structure wherein three Mg-doped GaN crystal recovery layers (thickness: 5 nm) are inserted at equal intervals into a Mg-doped p-type Al0.1Ga0.9N (Mg concentration: 2 x 10<19>cm<-1>, thickness: 0.5 mu m). The above III Group nitride semiconductor element allows the reduction of the defect density of an AlGaN cladding layer in a III Group nitride semiconductor laser.
申请公布号 WO02069466(A1) 申请公布日期 2002.09.06
申请号 WO2002JP01151 申请日期 2002.02.12
申请人 NEC CORPORATION;SASAOKA, CHIAKI 发明人 SASAOKA, CHIAKI
分类号 H01L21/205;H01L33/06;H01L33/10;H01L33/32;H01L33/40;H01S5/30;H01S5/323;H01S5/343;(IPC1-7):H01S5/343;H01L33/00 主分类号 H01L21/205
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