| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device in which an interval between external terminals formed by an inner lead bonding technology are made narrower, and to provide a substrate used for the device. SOLUTION: The semiconductor device is constituted by wiring finger leads 14 in a pair of narrow and long device holes 11 made through a support substrate 1 of a TAP tape, etc., from both sides and electrically connecting the finger leads 14 to a semiconductor chip 2. The narrow and long device holes 11 are made through the substrate 1 along a pair of edges of the substrate 1 opposing each other. Solder balls are arranged along the holes 11 as the external terminals. In each hole 11, in addition, the finger leads 14 are alternately extended from both sides. One end section of the leads 14 is electrically connected to one end of the semiconductor chip 2. |
