| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutter for semiconductor wafer which can easily polish the cross section of a semiconductor wafer, while cutting the semiconductor wafer. SOLUTION: The blade section 10 of the semiconductor wafer cutter has a grindstone 11 for cutting and a grindstone 12 for polishing. The grindstone 11 for cutting is one where abrasive grains, such as diamond or the like are fixed to the periphery of a doughnut-form metallic thin plate. The grindstone 12 for polishing is one, where abrasive grains such as diamond or the like are fixed to the inside of the periphery of the metal thin plate. The grain diameter of the abrasive grain of the grindstone 12 for polishing is smaller than the grain diameter of the abrasive grain of the grindstone 11 for cutting. The thickness of the grindstone 12 for polishing in the direction of center axis of the metal thin plate is larger than the thickness of the grindstone 11 for cutting, and it becomes larger gradually going inward from the peripheral side of the metal thin plate. |
