发明名称 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method, capable of precise treatment by a drug solution by eliminating the density difference of chemical on the surface of a substrate to be treated. SOLUTION: A drug solution discharging/suction part (scan nozzle) 21 is provided with a drug solution discharge opening 22 for discharging drug solution to the substrate to be treated and a drug solution suction opening 23 for sucking the drug solution to on the substrate to be treated. The drug solution, discharged continuously from the opening 22, is sucked continuously by the opening 23 to always supply a fresh drug solution to the surface of the substrate to be treated to an area between the opening 22 and the opening 23 between the scan nozzle 21 and the substrate to be treated.
申请公布号 JP2002252167(A) 申请公布日期 2002.09.06
申请号 JP20010304016 申请日期 2001.09.28
申请人 TOSHIBA CORP 发明人 SAKURAI HIDEAKI;ITO MASAMITSU;ITO SHINICHI
分类号 G03F7/30;G03D5/00;G03F7/40;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):H01L21/027 主分类号 G03F7/30
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