| 摘要 |
PROBLEM TO BE SOLVED: To provide a small short-height electronic component having a mold resin outer covering which will not break, even at a high temperature, such as in soldering re-flow condition, by reducing the number of parts in a chip-type electronic component having the structure of the mold resin outer covering. SOLUTION: The electronic component has at least a pair of electrode lead terminals 1 and 2 which make no contact with each other via an element layered product 3. The pair of terminals 1 and 2 consist of the same shape and the electrode lead terminals, and the mold resin outer coverings 4 are molded to be flush with each other. The terminals 1 and 2 have confronting parts 11, which are arranged so as to superpose and catch each other. The mold resin of the outer covering 4 flows into between the parts 1, and a pair of the terminals 1 and 2 are insulated from each other by this mold resin. |
