| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste for semiconductor having high adhesive strength and high solder crack resistance with low elasticity modulus when heated, which does not generate characteristic defectives of IC and the like due to chip cracks and warpage, even in the case of combination of a large sized chip of IC and the like and, a lead frame and the like with a large coefficient of linear expansion, and does not deteriorate adhesive strength when heated after moisture absorption. SOLUTION: This resin paste for semiconductor is made of (A) thermosetting resin and (B) filler, which has shearing bond strength of more than 2 MPa at 260 deg.C after leaving it for 72 hours under high temperature and high humidity of 85$0C, 85% and, modulus of elasticity being less than 100 MPa at 260 deg.C. |
