| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass for packaging a semiconductor which is capable of suppressing contamination by radioactive isotopes, specifically U, or by undissolved platinum into the glass, and also provide a glass which is useful for packaging semiconductors such as a solid-state image pick up element and has specifically low U content among radioactive isotopes and undissolved platinum, high weatherability, high solarization resistance and good sealability with respect to an alumina ceramic package. SOLUTION: A raw material batch of the glass is melted into a molten glass, and the obtained molten glass is deformed and homogenized and is further homogenized for removing striae so that the glass for the packaging the semiconductor is obtained. The glass melting process is carried out at least in a furnace made of refractory having uranium content of 20 ppm or less.
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