发明名称 HEAT-CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a heat-curable composition showing an excellent heat curing rate, containing a compound having an oxetane ring and an acid anhydride. SOLUTION: The purpose is accomplished by using the heat-curable composition comprising a compound having an oxetane ring, an acid anhydride and zinc carboxylate or acetylacetonate, and a heat curing accelerator comprising zinc carboxylate or acetylacetonate.
申请公布号 JP2002249578(A) 申请公布日期 2002.09.06
申请号 JP20010049730 申请日期 2001.02.26
申请人 UBE IND LTD 发明人 YAMASHITA MASAYOSHI;MIWA YOSHIYUKI
分类号 C08G65/26;(IPC1-7):C08G65/26 主分类号 C08G65/26
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