发明名称 INTERMEDIATE PLATE FOR MANUFACTURING CIRCUIT FORMING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an intermediate plate which is repeatedly used in the thermal press molding process of a board for preventing a deformation and defects on its surface and by which abrasion in a polishing and cleaning process can be prevented, and which is used for manufacturing method including a thermal-press process, wherein a prepreg, which forms a circuit by using a metal foil or a laminated material in which the metal foil or resin is arranged at one face or both faces of the prepreg composed of a single or a plurality of materials, is sandwiched by the intermediate plate, and either of heating or pressurizing, or both of them, are applied to the plate. SOLUTION: The intermediate plate is made by forming a hard layer on the surface of a metal plate. The deformation and the defects of the surface are prevented in the process of treating the intermediate plate by its hardened surface and its life is extended by its abrasion resistance. A stainless steel is especially used and its surface is hardened by forming a nitride layer on its surface by nitriding for forming the intermediate plate. Before nitriding, a fluoride layer is formed on the surface for homogenizing and sophisticating the nitride layer.
申请公布号 JP2002252440(A) 申请公布日期 2002.09.06
申请号 JP20010051982 申请日期 2001.02.27
申请人 MATSUSHITA ELECTRIC IND CO LTD;TAIKA KOGYO KK;AIR WATER INC 发明人 TATSUMI KIYOHIDE;NISHII TOSHIHIRO;NAKAMURA SHINJI;KENMOCHI FUMIO;ARIFUKU KAZUHIKO;TEJIMA SHIZUHIRO;MORIYA TOSHIAKI;SHIMADA NAOHISA;SHIRAHATA TOMOKI;WATANABE TAKANORI
分类号 B30B15/34;B29C43/18;B29C43/36;B32B15/04;H01L21/32;H05K3/00;(IPC1-7):H05K3/00 主分类号 B30B15/34
代理机构 代理人
主权项
地址