CONTROLLED ATTENUATION CAPILLARY

摘要

A controlled attenuation bonding tool for bonding a fine wire to a substrate. In one embodiment, the bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section. In another embodiment, the bonding tool comprises a planar area along at least a portion of a length of a cylindrical portion.