发明名称 PIN GRID ARRAY SOCKET WITH REINFORCEMENT PLATE
摘要 A socket for a PGA package can maintain high reliability of connecting condition for a long period. The socket is constructed by mounting a reinforcement plate formed with a metal plate or the like at the position where the cam member contacts the slide plate so that the slide plate, which is formed of an insulative materials such as plastic or the like, will not be deformed upon exertion of a reaction force from a plurality of lead pins of a PGA package.
申请公布号 WO02069684(A2) 申请公布日期 2002.09.06
申请号 WO2002US05459 申请日期 2002.02.22
申请人 MOLEX INCORPORATED;HIRATA, TOSHIHISA;SASAO, MASAMI 发明人 HIRATA, TOSHIHISA;SASAO, MASAMI
分类号 H01R33/76;H01L23/32;H01R13/193;H05K7/10 主分类号 H01R33/76
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