In order to increase the electric power transmitted by a contact device (10), a connection area (14) is provided on at least one contact area (11,12) of said contact device (10). The connection area is embodied in such a way that it establishes a thermal link with the cooling area (28) of a circuit (20) in order to convey heat from the contact device (10) to the cooling device (28) and consequently dissipate the heat of the contact device (10).
申请公布号
WO0223632(B1)
申请公布日期
2002.09.06
申请号
WO2001DE03239
申请日期
2001.08.23
申请人
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO.KG;BAYERER, REINHOLD;VETTER, ANDREAS;FERBER, GOTTFRIED
发明人
BAYERER, REINHOLD;VETTER, ANDREAS;FERBER, GOTTFRIED