发明名称 HEAT SINK AND MODULE STRUCTURE USING THE HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a superior reliability and inexpensive module structure having high heat radiation properties. SOLUTION: A heat sink is made of a copper alloy having a Vickers hardness of at least 70 HV after heat treatment for 4 minutes at 630 deg.C. The module structure uses the heat sink and has a structure where a ceramic circuit board is integrated with the heat sink via a brazing material.
申请公布号 JP2002252317(A) 申请公布日期 2002.09.06
申请号 JP20010051713 申请日期 2001.02.27
申请人 DENKI KAGAKU KOGYO KK 发明人 UTO MANABU;SUGIMOTO ISAO;EMOTO HIDEYUKI;IBUKIYAMA MASAHIRO
分类号 H01L23/40;H01L23/373 主分类号 H01L23/40
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