发明名称 |
HEAT SINK AND MODULE STRUCTURE USING THE HEAT SINK |
摘要 |
PROBLEM TO BE SOLVED: To provide a superior reliability and inexpensive module structure having high heat radiation properties. SOLUTION: A heat sink is made of a copper alloy having a Vickers hardness of at least 70 HV after heat treatment for 4 minutes at 630 deg.C. The module structure uses the heat sink and has a structure where a ceramic circuit board is integrated with the heat sink via a brazing material. |
申请公布号 |
JP2002252317(A) |
申请公布日期 |
2002.09.06 |
申请号 |
JP20010051713 |
申请日期 |
2001.02.27 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
UTO MANABU;SUGIMOTO ISAO;EMOTO HIDEYUKI;IBUKIYAMA MASAHIRO |
分类号 |
H01L23/40;H01L23/373 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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